Power chips are connected to external circuits with packaging, and their performance relies on the assistance of the product packaging. In high-power situations, power chips are normally packaged as power modules. Chip interconnection describes the electrical link on the upper surface of the chip, which is usually aluminum bonding wire in traditional modules. ^
Typical power module plan cross-section

Today, industrial silicon carbide power components still mainly utilize the product packaging innovation of this wire-bonded typical silicon IGBT component. They encounter issues such as huge high-frequency parasitical criteria, not enough heat dissipation ability, low-temperature resistance, and not enough insulation stamina, which limit using silicon carbide semiconductors. The screen of excellent efficiency. In order to address these problems and fully exploit the big possible benefits of silicon carbide chips, numerous brand-new packaging technologies and solutions for silicon carbide power components have emerged over the last few years.

Silicon carbide power component bonding approach

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have developed from gold cable bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually established from gold cables to copper cables, and the driving pressure is price decrease; high-power gadgets have established from aluminum cords (strips) to Cu Clips, and the driving force is to boost item efficiency. The greater the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a solid copper bridge soldered to solder to link chips and pins. Compared with conventional bonding product packaging approaches, Cu Clip innovation has the adhering to benefits:

1. The link in between the chip and the pins is constructed from copper sheets, which, to a specific degree, replaces the common wire bonding technique between the chip and the pins. Therefore, a special plan resistance value, greater existing flow, and far better thermal conductivity can be acquired.

2. The lead pin welding location does not require to be silver-plated, which can totally save the expense of silver plating and poor silver plating.

3. The item appearance is totally consistent with typical products and is primarily used in web servers, portable computer systems, batteries/drives, graphics cards, electric motors, power supplies, and other fields.

Cu Clip has two bonding techniques.

All copper sheet bonding approach

Both eviction pad and the Source pad are clip-based. This bonding technique is a lot more costly and intricate, however it can accomplish much better Rdson and far better thermal impacts.

( copper strip)

Copper sheet plus cable bonding approach

The source pad uses a Clip approach, and the Gate uses a Cord method. This bonding method is slightly more affordable than the all-copper bonding method, saving wafer location (suitable to very little gate areas). The procedure is simpler than the all-copper bonding approach and can acquire much better Rdson and better thermal effect.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding things made of copper, please feel free to contact us and send an inquiry.

Inquiry us